Most devices now are taking on old generation PCBs. Which means components are transmitting and receiving frequencies that will range from 600 MHz up to 5.925 GHz and bandwidth channels of 20MHz, or 200kHz for Internet of things circuits assembly. When creating 5g circuit board design for, the components will require Mm-wave frequencies of 28GHz, 30GHz, and even 77GHz in line with the application. For bandwidth channels, 5G systems should be dealing with 100MHz right below and 400 MHz right above 6GHz frequencies.
These higher speeds and higher frequencies will demand the appropriate materials inside the PCB to recapture and transmit both lower and higher signals on top of that without experiencing signal loss and EMI. In addition, an added problem is the fact that devices will become lighter, portable, and smaller. With strict weight, size, and space limitations, the PCB materials should be flexible and light while accommodating all of the microelectronics over the board pcb assembly factory.
Thinner lines and more strict impedance control will have to be followed to when it comes to PCB copper lines. The standard subtractive etching utilized for 3G and 4G high-speed PCBs could be switched out for modified semi-additive processes. These improved semi-additive processes will provide you with more precise trace lines and straighter walls. Material substrates are also being newly designed. Printed circuit board companies will be looking at materials that offer a dielectric constant as low as 3, as standard materials for lower speed PCBs are usually 3.5 to 5.5. More restrictive fiberglass weaves, lower heat dissipation factor loss materials, and low-profile copper can also be choices for 5g circuit board employed for digital signals to prevent signal losses and to promote greater signal reliability.
EMI, cross talk, and parasitical capacitance are major issues with 5g circuit boards printed circuits assembly. To manage cross talk and EMI that will be present due to the analog and digital frequencies over the board, separating the traces is highly recommended.